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1. A method of encapsulating an OLED device, comprising:(a) forming an OLED device on a substrate;(b) providing a protective cover surrounding the OLED device and the substrate;(c) providing a first sealing arrangement between the protective cover and top surface of the substrate, to define a first chamber enclosing the OLED device;(d) providing a second sealing arrangement sealed to define a second chamber sealed from and enclosing the first chamber; and(e) providing first desiccant material in the first chamber and providing second desiccant material in the second chamber closer to the bottom surface of the substrate than the top surface.
2. The method of claim 1 wherein the substrate defines two coplanar surfaces.
3. The method of claim 1 wherein the first and second desiccant materials are particulate materials or particulate materials formed into a matrix.
4. The method of claim 1 wherein the first desiccant material has an equilibrium humidity level less than that of the second desiccant material.
5. The method of claim 4 wherein the first desiccant material has an equilibrium humidity level less than 1000 ppm.
6. The method of claim 4 wherein the second desiccant material has an equilibrium humidity level greater than 1000 ppm.
7. The method of claim 1 wherein the second desiccant material absorbs moisture faster than the first desiccant material.
8. The method of claim 1 further providing one or more thin-film encapsulation layers over the OLED device.
9. The method of claim 1 wherein the protective cover is spaced from the OLED device and a polymer buffer layer is disposed between the OLED device and the protective cover.
10. The method of claim 1 wherein the first sealing arrangement or the second sealing arrangement or both include a glass ledge.
11. The method of claim 1 further providing that the distance between the first desiccant material and the substrate is less than the thickness of the first sealing arrangement.
12. The method of claim 1 wherein the protective cover comprises two or more pieces and a third sealing arrangement between them that forms a single unified protective cover.
13. The method of claim 1 wherein the second sealing arrangement is sealed to a second portion of the substrate between the protective cover and the substrate.
14. The method of claim 13 wherein the substrate defines two coplanar surfaces.
15. The method of claim 13 wherein the first and second desiccant materials are particulate materials or particulate materials formed into a matrix.
16. The method of claim 13 wherein the first desiccant material has an equilibrium humidity level less than that of the second desiccant material.
17. The method of claim 16 wherein the first desiccant material has an equilibrium humidity level less than 1000 ppm.
18. The method of claim 16 wherein the second desiccant material has an equilibrium humidity level greater than 1000 ppm.
19. The method of claim 13 wherein the second desiccant material absorbs moisture faster than the first desiccant material.
20. The method of claim 13 further providing one or more thin-film encapsulation layers over the OLED device.
21. The method of claim 13 wherein the protective cover is spaced from the OLED device and a polymer buffer layer is disposed between the OLED device and the protective cover.
22. The method of claim 13 wherein the first sealing arrangement or the second sealing arrangement or both include a glass ledge.
23. The method of claim 13 further providing that the distance between the first desiccant material and the substrate is less than the thickness of the first sealing arrangement.
24. The method of claim 13 wherein the protective cover comprises two or more pieces and a third sealing arrangement between them that forms a single unified protective cover. |
